Issued Patents 2002
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6465365 | Method of improving adhesion of cap oxide to nanoporous silica for integrated circuit fabrication | — | 2002-10-15 |
| 6418875 | Method of improving adhesion of cap oxide to nanoporous silica for integrated circuit fabrication | — | 2002-07-16 |
| 6413877 | Method of preventing damage to organo-silicate-glass materials during resist stripping | — | 2002-07-02 |
| 6387797 | Method for reducing the capacitance between interconnects by forming voids in dielectric material | Subhas Bothra | 2002-05-14 |
| 6380092 | Gas phase planarization process for semiconductor wafers | Calvin T. Gabriel, Milind Weling | 2002-04-30 |