Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6465330 | Method for grinding a wafer back | Kazuhiro Takahashi, Kazuyoshi Ebe | 2002-10-15 |
| 6337258 | Method of dividing a wafer | Hideo Nakayoshi, Keisuke Tokubuchi, Tetsuya Kurosawa | 2002-01-08 |