Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6465330 | Method for grinding a wafer back | Kazuhiro Takahashi, Shinya Takyu | 2002-10-15 |
| 6436795 | Process for producing semiconductor chip | Hayato Noguchi | 2002-08-20 |
| 6398892 | Method of using pressure sensitive adhesive double coated sheet | Hayato Noguchi, Yoshihisa Mineura | 2002-06-04 |