Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6352073 | Semiconductor manufacturing equipment | Tetsuya Kurosawa, Hideo Numata | 2002-03-05 |
| 6337258 | Method of dividing a wafer | Hideo Nakayoshi, Shinya Takyu, Tetsuya Kurosawa | 2002-01-08 |