Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6384481 | Single step electroplating process for interconnect via fill and metal line patterning | Makarem A. Hussein, Sam Sivakumar | 2002-05-07 |
| 6346144 | Chemical-mechanical polishing slurry | — | 2002-02-12 |