Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6492071 | Wafer scale encapsulation for integrated flip chip and surface mount technology assembly | Mark V. Pierson, Ajit K. Trivedi | 2002-12-10 |
| 6425772 | Conductive adhesive having a palladium matrix interface between two metal surfaces | Edward G. Bundga | 2002-07-30 |