Issued Patents 2002
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6492071 | Wafer scale encapsulation for integrated flip chip and surface mount technology assembly | William E. Bernier, Mark V. Pierson | 2002-12-10 |
| 6453537 | Cooling method for electronic components | Craig G. Heim, Wade Leslie Hooker | 2002-09-24 |
| 6437254 | Apparatus and method for printed circuit board repair | Alan Harris Crudo, John G. Davis, Christian Robert Le Coz, Mark V. Pierson, Amit K. Sarkhel | 2002-08-20 |
| 6353182 | Proper choice of the encapsulant volumetric CTE for different PGBA substrates | Chi-Shih Chang, William T. Chen | 2002-03-05 |