EB

Edward G. Bundga

IBM: 1 patents #1,916 of 5,400Top 40%
📍 Endicott, NY: #30 of 79 inventorsTop 40%
🗺 New York: #3,002 of 9,277 inventorsTop 35%
Overall (2002): #226,042 of 266,432Top 85%
1
Patents 2002

Issued Patents 2002

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6425772 Conductive adhesive having a palladium matrix interface between two metal surfaces William E. Bernier 2002-07-30