Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6441312 | Electronic package with plurality of solder-applied areas providing heat transfer | Hirotoshi Tanimura, Keiichi Ohtsubo | 2002-08-27 |
SU
Shinji Ueno
Overall (2002): #116,627 of 266,432Top 45%
1
Patents 2002