Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6441312 | Electronic package with plurality of solder-applied areas providing heat transfer | Keiichi Ohtsubo, Shinji Ueno | 2002-08-27 |
HT
Hirotoshi Tanimura
Overall (2002): #204,526 of 266,432Top 80%
1
Patents 2002