KO

Keiichi Ohtsubo

IBM: 1 patents #1,916 of 5,400Top 40%
📍 Moriyama, JP: #72 of 271 inventorsTop 30%
Overall (2002): #175,229 of 266,432Top 70%
1
Patents 2002

Issued Patents 2002

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6441312 Electronic package with plurality of solder-applied areas providing heat transfer Hirotoshi Tanimura, Shinji Ueno 2002-08-27