Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6475877 | Method for aligning die to interconnect metal on flex substrate | Richard Joseph Saia, Kevin Matthew Durocher, James Wilson Rose | 2002-11-05 |
| 6410356 | Silicon carbide large area device fabrication apparatus and method | Robert J. Wojnarowski, Ernest Wayne Balch | 2002-06-25 |
| 6396153 | Circuit chip package and fabrication method | Raymond Albert Fillion, Ernest Wayne Balch, Ronald Frank Kolc, William Edward Burdick, Jr., Robert J. Wojnarowski +1 more | 2002-05-28 |