Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6475877 | Method for aligning die to interconnect metal on flex substrate | Richard Joseph Saia, James Wilson Rose, Leonard Richard Douglas | 2002-11-05 |
| 6429381 | High density interconnect multichip module stack and fabrication method | Richard Joseph Saia, Robert J. Wojnarowski, Stanton Earl Weaver, Christopher James Kapusta, James Sabatini | 2002-08-06 |