Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6429381 | High density interconnect multichip module stack and fabrication method | Richard Joseph Saia, Robert J. Wojnarowski, Stanton Earl Weaver, Kevin Matthew Durocher, Christopher James Kapusta | 2002-08-06 |