Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6396153 | Circuit chip package and fabrication method | Raymond Albert Fillion, Ernest Wayne Balch, William Edward Burdick, Jr., Robert J. Wojnarowski, Leonard Richard Douglas +1 more | 2002-05-28 |