Issued Patents 2002
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6495441 | Semiconductor device with gold bumps, and method and apparatus of producing the same | Masayuki Kitajima, Masakazu Takesue | 2002-12-17 |
| 6444923 | Method of connecting printed wiring boards with each other, and printed circuit board | Shigeo Iriguchi, Satoshi Watanabe | 2002-09-03 |
| 6432806 | Method of forming bumps and template used for forming bumps | Masayuki Kitajima, Yutaka Noda | 2002-08-13 |
| 6344690 | Semiconductor device with gold bumps, and method and apparatus of producing the same | Masayuki Kitajima, Masakazu Takesue | 2002-02-05 |