Issued Patents 2002
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6495441 | Semiconductor device with gold bumps, and method and apparatus of producing the same | Masakazu Takesue, Yoshitaka Muraoka | 2002-12-17 |
| 6467141 | Method of assembling micro-actuator | Toru Okada, Kenji Iketaki, Hidehiko Kobayashi, Yutaka Noda, Seiichi Shimoura +4 more | 2002-10-22 |
| 6432806 | Method of forming bumps and template used for forming bumps | Yutaka Noda, Yoshitaka Muraoka | 2002-08-13 |
| 6428911 | Soldering method and soldered joint | Masakazu Takesue, Tadaaki Shono, Motoko Fujioka | 2002-08-06 |
| 6361626 | Solder alloy and soldered bond | Hitoshi Homma, Masakazu Takesue, Tadaaki Shono, Yutaka Noda | 2002-03-26 |
| 6344690 | Semiconductor device with gold bumps, and method and apparatus of producing the same | Masakazu Takesue, Yoshitaka Muraoka | 2002-02-05 |