Issued Patents 2002
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6500317 | Plating apparatus for detecting the conductivity between plating contacts on a substrate | Junichiro Yoshioka, Satoshi Sendai, Mitsuo Tada, Akihisa Hongo, Yoshitaka Mukaiyama +4 more | 2002-12-31 |
| 6379520 | Plating apparatus | Fumio Kuriyama, Hiroyuki Ueyama, Junitsu Yamakawa, Kenichi Suzuki | 2002-04-30 |
| 6365017 | Substrate plating device | Akihisa Hongo, Naoaki Ogure, Hiroyuki Ueyama, Junitsu Yamakawa, Mizuki Nagai +3 more | 2002-04-02 |
| 6365020 | Wafer plating jig | Junichiro Yoshioka, Kenya Tomioka, Satoshi Sendai, Naomitsu Ozawa | 2002-04-02 |