Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6500317 | Plating apparatus for detecting the conductivity between plating contacts on a substrate | Satoshi Sendai, Atsushi Chono, Mitsuo Tada, Akihisa Hongo, Yoshitaka Mukaiyama +4 more | 2002-12-31 |
| 6365020 | Wafer plating jig | Kenya Tomioka, Satoshi Sendai, Atsushi Chono, Naomitsu Ozawa | 2002-04-02 |