Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6492242 | Method of forming of high K metallic dielectric layer | Alex See, Cher Liang Cha, Shyuz Fong Quek, Ting Cheong Ang, Sang Yee Loong +2 more | 2002-12-10 |
| 6468906 | Passivation of copper interconnect surfaces with a passivating metal layer | Lap Chan, Kuan Pei Yap, Kheng Chok Tee, Flora S. Ip | 2002-10-22 |