Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6468906 | Passivation of copper interconnect surfaces with a passivating metal layer | Lap Chan, Kuan Pei Yap, Kheng Chok Tee, Wye Boon Loh | 2002-10-22 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6468906 | Passivation of copper interconnect surfaces with a passivating metal layer | Lap Chan, Kuan Pei Yap, Kheng Chok Tee, Wye Boon Loh | 2002-10-22 |