Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6451670 | Substrate processing apparatus, substrate support apparatus, substrate processing method, and substrate fabrication method | Takao Yonehara, Kenji Yamagata | 2002-09-17 |
| 6383890 | Wafer bonding method, apparatus and vacuum chuck | Takao Yonehara, Kenji Yamagata | 2002-05-07 |