Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6448171 | Microelectronic fabrication having formed therein terminal electrode structure providing enhanced passivation and enhanced bondability | Te-Sung Wu | 2002-09-10 |
| 6424037 | Process to make a tall solder ball by placing a eutectic solder ball on top of a high lead solder ball | Chung W. Ho | 2002-07-23 |
| 6362087 | Method for fabricating a microelectronic fabrication having formed therein a redistribution structure | Te-Sung Wu, Erh-Kong Chieh | 2002-03-26 |