Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6448171 | Microelectronic fabrication having formed therein terminal electrode structure providing enhanced passivation and enhanced bondability | Tsing-Chow Wang | 2002-09-10 |
| 6362087 | Method for fabricating a microelectronic fabrication having formed therein a redistribution structure | Tsing-Chow Wang, Erh-Kong Chieh | 2002-03-26 |