Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6455926 | High density cavity-up wire bond BGA | — | 2002-09-24 |
| 6424037 | Process to make a tall solder ball by placing a eutectic solder ball on top of a high lead solder ball | Tsing-Chow Wang | 2002-07-23 |