Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6472307 | Methods for improved encapsulation of thick metal features in integrated circuit fabrication | Donald C. Dennis, Nace Layadi, Simon John Molloy, Sylvia Thomas | 2002-10-29 |
| 6432814 | Method of manufacturing an interconnect structure having a passivation layer for preventing subsequent processing reactions | Susan Clay Vitkavage | 2002-08-13 |
| 6362094 | Hydrogenated silicon carbide as a liner for self-aligning contact vias | Gary Dabbaugh, Gerald W. Gibson, Troy A. Giniecki | 2002-03-26 |