Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5668061 | Method of back cutting silicon wafers during a dicing procedure | David J. Collins, Kevin A. Lindamood | 1997-09-16 |
| 5637388 | Layered resinoid/diamond blade for precision cutting operations and method of manufacturing same | Robert M. White, Robert P. Altavela, Alex S. Brougham, Robert A. Clingerman | 1997-06-10 |