Issued Patents 1997
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5668061 | Method of back cutting silicon wafers during a dicing procedure | Lawrence H. Herko, David J. Collins | 1997-09-16 |
KL
Kevin A. Lindamood
Overall (1997): #182,882 of 185,788Top 100%
1
Patents 1997