Issued Patents 1997
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5689091 | Multi-layer substrate structure | Ahmad Hamzehdoost | 1997-11-18 |
| 5661337 | Technique for improving bonding strength of leadframe to substrate in semiconductor IC chip packages | — | 1997-08-26 |
| 5646831 | Electrically enhanced power quad flat pack arrangement | — | 1997-07-08 |