Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5687474 | Method of assembling and cooling a package structure with accessible chip | Leonard L. Mora | 1997-11-18 |
| 5689091 | Multi-layer substrate structure | Kamran Manteghi | 1997-11-18 |