Issued Patents 1997
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5688714 | Method of fabricating a semiconductor device having a top layer and base layer joined by wafer bonding | Franciscus Petrus Widdershoven, Arie J. R. De Kock, Aart A. Van Gorkum | 1997-11-18 |
| 5637028 | Method of polishing a surface of a noble metal | Cornelis L. Adema, Lambertus Postma, Mathijs P. H. Souts | 1997-06-10 |
| 5622525 | Method of polishing a surface of copper or an alloy comprising mainly copper | Peter W. De Haas, Dirk Kornelis Gerhardus De Boer, Waltherus Van Den Hoogenhof, Lambertus Postma | 1997-04-22 |