Issued Patents 1997
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5688714 | Method of fabricating a semiconductor device having a top layer and base layer joined by wafer bonding | Franciscus Petrus Widdershoven, Jan Haisma, Aart A. Van Gorkum | 1997-11-18 |