Issued Patents 1997
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5703408 | Bonding pad structure and method thereof | Liu Ming-Tsung, Bill Hsu, Hsien-Dar Chung | 1997-12-30 |
| 5668393 | Locos technology with reduced junction leakage | Water Lur, Jiunn Y. Wu | 1997-09-16 |
| 5599746 | Method to eliminate polycide peeling at wafer edge using extended scribe lines | Water Lur | 1997-02-04 |