Issued Patents 1997
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5640760 | Method for the 3D interconnection of packages of electronic components using printed circuit boards | Christian Val | 1997-06-24 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5640760 | Method for the 3D interconnection of packages of electronic components using printed circuit boards | Christian Val | 1997-06-24 |