Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5640760 | Method for the 3D interconnection of packages of electronic components using printed circuit boards | Andre Gerard | 1997-06-24 |
| 5637536 | Method for interconnecting semiconductor chips in three dimensions, and component resulting therefrom | — | 1997-06-10 |