Issued Patents 1997
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5668398 | Multilevel interconnect structure with air gaps formed between metal leads | Shin-Puu Jeng | 1997-09-16 |
| 5668411 | Diffusion barrier trilayer for minimizing reaction between metallization layers of integrated circuits | Qi-Zhong Hong, Shin-Puu Jeng | 1997-09-16 |
| 5661344 | Porous dielectric material with a passivation layer for electronics applications | Bruce E. Gnade, Chih-Chen Cho | 1997-08-26 |
| 5605724 | Method of forming a metal conductor and diffusion layer | Qi-Zhong Hong | 1997-02-25 |