Issued Patents 1997
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5684356 | Hydrogen-rich, low dielectric constant gate insulator for field emission device | Bruce E. Gnade | 1997-11-04 |
| 5668398 | Multilevel interconnect structure with air gaps formed between metal leads | Robert H. Havemann | 1997-09-16 |
| 5668411 | Diffusion barrier trilayer for minimizing reaction between metallization layers of integrated circuits | Qi-Zhong Hong, Robert H. Havemann | 1997-09-16 |
| 5654575 | TiSi.sub.2 /TiN clad interconnect technology | — | 1997-08-05 |
| 5621235 | TiSi.sub.2 /TiN clad interconnect technology | — | 1997-04-15 |
| 5616959 | Planarized multi-level interconnect scheme with embedded low-dielectric constant insulators | — | 1997-04-01 |
| 5591677 | Planarizeed multi-level interconnect scheme with embedded low-dielectric constant insulators | — | 1997-01-07 |