Issued Patents 1997
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5646068 | Solder bump transfer for microelectronics packaging and assembly | Arthur M. Wilson, Mark A. Kressley, Dean L. Frew, John E. Hanicak, Philip Hecker +1 more | 1997-07-08 |