Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5672933 | Column-to-column isolation in fed display | Robert H. Taylor, Chi-Cheong Shen | 1997-09-30 |
| 5646068 | Solder bump transfer for microelectronics packaging and assembly | Mark A. Kressley, Dean L. Frew, Juanita G. Miller, John E. Hanicak, Philip Hecker +1 more | 1997-07-08 |