Issued Patents 1997
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5652042 | Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste | Kouji Kawakita, Seiichi Nakatani, Masatoshi Suehiro, Kouichi Iwaisako, Hideo Akiyama | 1997-07-29 |