Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5652042 | Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste | Kouji Kawakita, Tatsuo Ogawa, Masatoshi Suehiro, Kouichi Iwaisako, Hideo Akiyama | 1997-07-29 |
| 5622590 | Semiconductor device and method of manufacturing the same | Yoshinobu Kunitomo, Makoto Nozu, Yasuyuki Sakashita, Masahide Tsukamoto, Keiji Saeki +1 more | 1997-04-22 |