Issued Patents 1997
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5643490 | Polymer solid electrolyte composition | Kenichi Takahashi, Hiroyuki Akashi, Koichi Tanaka | 1997-07-01 |
| 5615823 | Soldering ball mounting apparatus and method | Siniti Nakazato | 1997-04-01 |
| 5616960 | Multilayered interconnection substrate having a resin wall formed on side surfaces of a contact hole | Shinji Nakamura, Hisao Hayashi | 1997-04-01 |