Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5616960 | Multilayered interconnection substrate having a resin wall formed on side surfaces of a contact hole | Kazuhiro Noda, Shinji Nakamura | 1997-04-01 |
| 5602723 | Subrack device | Tsutomu Takahashi, Hiroshi Yamaji, Shigeru Amagasa, Takashi Sato, Tomoyuki Hongoh +5 more | 1997-02-11 |