Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5629835 | Metal ball grid array package with improved thermal conductivity | Deepak Mahulikar, Paul R. Hoffman | 1997-05-13 |
| 5608267 | Molded plastic semiconductor package including heat spreader | Deepak Mahulikar, Derek E. Tyler, James M. Popplewell | 1997-03-04 |