Issued Patents 1997
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5688606 | Anodized aluminum substrate having increased breakdown voltage | Efraim Sagiv, Arvind Parthasarathi, Satish Jalota, Andrew J. Brock, Michael A. Holmes +3 more | 1997-11-18 |
| 5650592 | Graphite composites for electronic packaging | Harvey P. Cheskis | 1997-07-22 |
| 5629835 | Metal ball grid array package with improved thermal conductivity | Paul R. Hoffman, Jeffrey S. Braden | 1997-05-13 |
| 5608267 | Molded plastic semiconductor package including heat spreader | Derek E. Tyler, Jeffrey S. Braden, James M. Popplewell | 1997-03-04 |