Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5656858 | Semiconductor device with bump structure | Ichiharu Kondo, Chikage Noritake | 1997-08-12 |
| 5641913 | Method and apparatus for accurate measurement of pull strength of bump electrodes on semiconductor devices | — | 1997-06-24 |