Issued Patents 1997
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5656858 | Semiconductor device with bump structure | Chikage Noritake, Yusuke Watanabe | 1997-08-12 |
| 5635764 | Surface treated structure for solder joint | Hisayoshi Fujikawa, Takeshi Ohwaki, Yasunori Taga, Osamu Takenaka, Kenji Kondo +1 more | 1997-06-03 |
| 5614291 | Semiconductor device and method of manufacturing the same | Yoshiaki Inaguma, Yoshitsugu Sakamoto | 1997-03-25 |