Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5686763 | Device module comprising a substrate having grooves fixed to circuit chips with improved sealing characteristics | Kenichi Tokuno | 1997-11-11 |
| 5602419 | Chip carrier semiconductor device assembly | Hidetoshi Takeda | 1997-02-11 |