Issued Patents 1997
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5686763 | Device module comprising a substrate having grooves fixed to circuit chips with improved sealing characteristics | Manabu Bonkohara | 1997-11-11 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5686763 | Device module comprising a substrate having grooves fixed to circuit chips with improved sealing characteristics | Manabu Bonkohara | 1997-11-11 |