Issued Patents 1997
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5635220 | Molding die for sealing semiconductor device with reduced resin burrs | Atsuhiko Izumi, Takehito Inaba | 1997-06-03 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5635220 | Molding die for sealing semiconductor device with reduced resin burrs | Atsuhiko Izumi, Takehito Inaba | 1997-06-03 |